Skip Navigation LinksProducts > Space & Component Technology > Advanced Products > Advanced Packaging Solutions

Designed right the first time

When you need a custom package designed to meet your stringent requirements in the Military, Space or Industrial market, you should call on the Advanced Products Group (APG) at TCS. With over 35 years of experience in project management and custom packaging we can provide the solution that will best meet your needs for reliability, quality, and ruggedness.

TCS combines the proven technologies listed below with robust design and testing to Military standards to meet your specific requirements.

Technology Benefit
Chip and Wire Size, Extended Temperature Range, Ruggedness, Hermetic
Chip-On-Board Size, Weight
Surface Mount Technology Size, Weight, Cost
Ball Grid Array Size, Ruggedness
FR4 Cost
BT Extended temperature range
Rigid-Flex Size, Weight, Density
Ceramic Hermetic, Ruggedness, Thermal Management

TCS has in service custom designs in the military, spacecraft and avionics systems. Some of these applications include “System-in-a package”, memory modules, and custom multichip modules. Most applications require our AS9100 certification to meet the customer demands in their service locations.

Contact TCS Space & Component Technology

1 866.264.0793

  • Europe: +44 (0) 75904 63366
Contact Information

Connections that Matter®

Connections that Matter - a video from TCS

Learn about TCS' offerings and markets, narrated by Dick Young, Executive VP & COO

See more videos from TCS »